The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2023

Filed:

Mar. 04, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Tao Li, Albany, NY (US);

Yann Mignot, Slingerlands, NY (US);

Ashim Dutta, Menands, NY (US);

Tsung-Sheng Kang, Ballston Lake, NY (US);

Wenyu Xu, Albany, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10N 50/10 (2023.01); H10N 50/01 (2023.01); H10N 50/80 (2023.01);
U.S. Cl.
CPC ...
H10N 50/80 (2023.02); H10N 50/01 (2023.02); H10N 50/10 (2023.02);
Abstract

A semiconductor structure may include a magnetic tunnel junction layer on top and in electrical contact with a microstud, a hard mask layer on top of the magnetic tunnel junction layer, and a liner positioned along vertical sidewalls of the magnetic tunnel junction layer and vertical sidewalls of the hard mask layer. A top surface of the liner may be below a top surface of the hard mask layer. The semiconductor structure may include a spacer on top of the liner. The liner may separate the spacer from the magnetic tunnel junction layer and the hard mask layer. The semiconductor structure may include a first metal layer below and in electrical contact with the microstud and a second metal layer above the hard mask layer. A bottom portion of the second metal layer may surround a top portion of the hard mask layer.


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