The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2023

Filed:

Nov. 17, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Mukta Ghate Farooq, Hopewell Junction, NY (US);

James J. Kelly, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 25/065 (2023.01); H01L 25/10 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5381 (2013.01); H01L 21/4846 (2013.01); H01L 23/5386 (2013.01); H01L 25/0655 (2013.01); H01L 25/105 (2013.01); H01L 23/481 (2013.01); H01L 2225/1041 (2013.01);
Abstract

Techniques for interconnecting chips using a bridge chip having through vias is provided. In one aspect, a structure includes: a bridge chip attached to at least a first chip and a second chip, wherein the bridge chip has at least one conductive through via connecting the bridge chip to one of the first chip and the second chip. The bridge chip can include a wiring layer having metal lines present between a first capping layer and a second capping layer, and the at least one conductive through via can directly contact at least a sidewall of at least one of the metal lines. A method of integrating chips using the present bridge chip is also provided.


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