The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2023

Filed:

Apr. 26, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Shih-Hsuan Chien, Hsinchu, TW;

Meng-Han Lin, Hsinchu, TW;

Han-Wei Wu, Tainan, TW;

Feng-Cheng Yang, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 51/20 (2023.01); H01L 23/528 (2006.01); G11C 11/22 (2006.01); H01L 23/522 (2006.01); H10B 51/10 (2023.01);
U.S. Cl.
CPC ...
H10B 51/20 (2023.02); G11C 11/2255 (2013.01); G11C 11/2257 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H10B 51/10 (2023.02);
Abstract

A method of forming a memory structure includes the following steps. A CMOS circuitry is formed over a semiconductor substrate. A bit line array is formed to be electrically connected to the CMOS circuitry. A memory array is formed over the bit line array. The memory array is formed by forming a word line stack, and forming first and second sets of stacked memory cells. The word line stack is formed on the bit line array and has a first side surface and a second side surface. The first sets of stacked memory cells are formed along the first side surface. The second sets of stacked memory cells are formed along the second side surface, wherein the second sets of stacked memory cells are staggered from the first sets of stacked memory cells. A source line array is formed over the memory array and electrically connected to the CMOS circuitry.


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