The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2023
Filed:
Jul. 15, 2022
Applicant:
Asmpt Singapore Pte. Ltd., Singapore, SG;
Inventors:
Man Kit Mui, Hong Kong, CN;
Kwun Man Ng, Hong Kong, CN;
Assignee:
ASMPT SINGAPORE PTE. LTD., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/78 (2013.01); B23K 20/004 (2013.01);
Abstract
A wire bonding system has a bonding tool and a wire guide for guiding a bonding wire to a tip of the bonding tool for conducting wire bonding operations. A wire biasing tool is located adjacent to the wire guide, and a rotary actuator is operatively connected to the wire biasing tool by a linkage mechanism. The rotary actuator is operable to move the wire biasing tool along a predetermined travel path to apply a biasing force onto a length of bonding wire extending from the tip of the bonding tool.