The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2023
Filed:
Jan. 26, 2021
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventor:
Makoto Shibuya, Beppu, JP;
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/78 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 21/4842 (2013.01); H01L 21/78 (2013.01); H01L 23/49524 (2013.01); H01L 23/49551 (2013.01); H01L 23/49562 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/38 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/97 (2013.01);
Abstract
System, method, and silicon chip package for providing structural strength, heat dissipation and electrical connectivity using 'W' shaped frame bonded to the one or more dies, wherein the 'W' shaped frame provides compression strength to the silicon chip package when the one or more dies are bonded, and electrically conductivity between for the one or more dies to leads of silicon chip package, and heat dissipation for the silicon chip package.