The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2023
Filed:
Jul. 05, 2022
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Michael Sheperek, Longmont, CO (US);
Bruce A. Liikanen, Berthoud, CO (US);
Steve Kientz, Westminster, CO (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 16/30 (2006.01); G11C 16/10 (2006.01); G11C 16/26 (2006.01); G11C 16/32 (2006.01); G06F 12/02 (2006.01); G06F 12/0882 (2016.01); G11C 16/34 (2006.01);
U.S. Cl.
CPC ...
G11C 16/10 (2013.01); G06F 12/0246 (2013.01); G06F 12/0882 (2013.01); G11C 16/26 (2013.01); G11C 16/30 (2013.01); G11C 16/32 (2013.01); G11C 16/3404 (2013.01); G06F 2212/7207 (2013.01); G11C 2207/2254 (2013.01);
Abstract
A first bin boundary for a first voltage bin associated with a die of a memory device is identified. The first bin boundary corresponds to a first block family associated with the first voltage bin. A first bin boundary offset between the first block family and a second block family is determined. The first bin boundary is updated based on the first bin boundary offset.