The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2023

Filed:

Sep. 22, 2022
Applicant:

Chroma Ate Inc., Taoyuan, TW;

Inventors:

Tsun-I Wang, Taoyuan, TW;

I-Shih Tseng, Taoyuan, TW;

Min-Hung Chang, Taoyuan, TW;

Tzu-Tu Chao, Taoyuan, TW;

Assignee:

CHROMA ATE INC., Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/20 (2006.01); G01R 1/073 (2006.01); G01R 1/067 (2006.01); G01R 1/28 (2006.01); G01R 31/3185 (2006.01);
U.S. Cl.
CPC ...
G01R 1/07385 (2013.01); G01R 1/06766 (2013.01); G01R 1/28 (2013.01); G01R 31/318511 (2013.01);
Abstract

A wafer inspection method and inspection apparatus are provided. On a wafer having layout lines connecting electrode points of individual dies in series, the dies within a matrix range are inspected one after another in turn in a column/row control means by a first switch group and a second switch group of a probe card, so that each die is selectively configured in a test loop of a test process by turning on/off of a corresponding switch. Thus, after inspection of a die under inspection (a selected die) within the matrix range is complete, the column/row control means is used to switch to a next die to achieve fast switching. Accordingly, for the inspection procedure of each die within the matrix region, a conventional procedure of moving one after another in turn can be eliminated, significantly reducing the total test time needed and enhancing inspection efficiency.


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