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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11840648 B1

PDFFull Text
Date of Patent:
Dec. 12, 2023

Filed:

Nov. 29, 2018

Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation material

Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Emi Miyazawa, Tokyo, JP;

Tsuyoshi Hayasaka, Tokyo, JP;

Takashi Kawamori, Tokyo, JP;

Shinichiro Sukata, Tokyo, JP;

Yoshihito Inaba, Tokyo, JP;

Keisuke Nishido, Tokyo, JP;

Assignee:

RESONAC CORPORATION, Tokyo, JP;

Attorney:

Wenderoth Lind & Ponack, L.L.P.

Primary Examiner:

Jaehwan Oh

Int. Cl.
CPC ...
C09J 4/06 (2006.01); C09J 7/30 (2018.01); B32B 7/12 (2006.01); B32B 17/06 (2006.01); B32B 37/12 (2006.01); B32B 43/00 (2006.01); C09J 9/02 (2006.01); C09J 11/04 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
C09J 4/06 (2013.01); B32B 7/12 (2013.01); B32B 17/06 (2013.01); B32B 37/12 (2013.01); B32B 43/006 (2013.01); C09J 7/30 (2018.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); H01L 21/6835 (2013.01); B32B 2037/1253 (2013.01); B32B 2310/0825 (2013.01); C09J 2203/326 (2013.01); C09J 2203/37 (2020.08); C09J 2409/00 (2013.01); C09J 2433/00 (2013.01); H01L 2221/68381 (2013.01);
Abstract

Disclosed is a semiconductor device manufacturing method, including a preparation step of preparing a laminated body in which a supporting member, a temporary fixation material layer that generates heat upon absorbing light, and a semiconductor member are laminated in this order, and a separation step of irradiating the temporary fixation material layer in the laminated body with incoherent light and thereby separating the semiconductor member from the supporting member.

Find Patent Forward Citations

Miyazawa, Emi. (2023). Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation material (U.S. Patent No. 11840648). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11840648

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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