The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2023
Filed:
May. 14, 2021
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Kenji Sugakawa, Koshi, JP;
Yosuke Omori, Koshi, JP;
Assignee:
TOKYO ELECTRON LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/84 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); H01L 24/83 (2013.01); H01L 2224/751 (2013.01); H01L 2224/7555 (2013.01); H01L 2224/83894 (2013.01);
Abstract
A bonding apparatus includes a holder; a pressing member; and a curvature adjuster. The holder is configured to attract and hold a substrate to be bonded. The pressing member is configured to come into contact with a central portion of the substrate attracted to and held by the holder and press the substrate to allow the central portion of the substrate to be protruded. The curvature adjuster is configured to adjust a curvature of the substrate pressed by the pressing member.