The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2023
Filed:
Nov. 29, 2021
Applicant:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Inventors:
Assignee:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49517 (2013.01); H01L 23/4952 (2013.01); H01L 23/49548 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H01L 23/49827 (2013.01); H01L 24/45 (2013.01); H01L 24/49 (2013.01); H01L 2924/181 (2013.01);
Abstract
A lead frame includes: a support portion having a through-hole formed in as end; a lead; and a heat dissipation plate welded with the support portion in one opening of the through-hole. A manufacturing method of a lead frame includes: shaping a frame member from a metal plate, the frame member including a support portion having a through-hole formed in an end, and a lead; and welding a heat dissipation plate with the support portion in one opening of the through hole.