The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2023
Filed:
Apr. 12, 2021
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Wei-Hua Houng, Hsinchu, TW;
Che-Fu Chen, Taipei, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/677 (2006.01); H01L 21/687 (2006.01); G01N 29/04 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67706 (2013.01); G01N 29/04 (2013.01); H01L 21/68707 (2013.01); H01L 22/10 (2013.01);
Abstract
A method includes positioning an end effector at a height lower than a height of a wafer. The end effector is moved to a position under the wafer. A wafer backside property of the wafer is detected by using a sensor on the end effector. The wafer backside property is analyzed to obtain an analysis result.