The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2023

Filed:

May. 10, 2023
Applicant:

Auros Technology, Inc., Hwaseong-si, KR;

Inventors:

Hyeon Gi Shin, Hwaseong-si, KR;

Bo Kyung Ryu, Hwaseong-si, KR;

Jung Sun Ko, Hwaseong-si, KR;

Jin Woo Park, Seongnam-si, KR;

Assignee:

AUROS TECHNOLOGY, INC., Hwaseong-si, KR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70633 (2013.01); G03F 7/70641 (2013.01); G03F 7/706849 (2023.05); G03F 7/706851 (2023.05); G03F 7/7085 (2013.01);
Abstract

An overlay measurement apparatus that can quickly measure an overlay error between layers with a large height difference is provided. The overlay measurement apparatus measures an error between a first overlay mark and a second overlay mark formed in a pair on different layers of a wafer. The overlay measurement apparatus includes an imaging system configured to acquire alignment images of a pair of first and second overlay marks at a plurality of focus positions, and a controller communicatively coupled to the imaging system. The overlay measurement apparatus can rapidly and accurately measure an overlay error between layers with a large height difference.


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Shin, Hyeon. (2023). Overlay measurement apparatus (U.S. Patent No. 11835865). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11835865

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