The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2023

Filed:

Oct. 01, 2021
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Mei-Ju Lu, Kaohsiung, TW;

Jr-Wei Lin, Kaohsiung, TW;

Chang-Feng You, Kaohsiung, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
G02B 6/12004 (2013.01); G02B 6/4203 (2013.01); G02B 2006/12121 (2013.01);
Abstract

An optoelectronic package is provided. The optoelectronic package includes a photonic component. The photonic component has a bottom surface and a lateral surface. The lateral surface of the photonic component includes a light coupling region and a non-light coupling plane. The non-light coupling plane contacts the bottom surface. The light coupling region and the non-light coupling plane are not aligned.


Find Patent Forward Citations

Lu, Mei-Ju. (2023). Optoelectronic package and method for manufacturing the same (U.S. Patent No. 11835757). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11835757

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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