The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2023
Filed:
Aug. 20, 2021
Applicant:
Towa Corporation, Kyoto, JP;
Inventors:
Assignee:
Towa Corporation, Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 43/36 (2006.01); B29C 43/18 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 43/18 (2013.01); B29C 43/36 (2013.01); B29C 2043/181 (2013.01); B29L 2031/3406 (2013.01);
Abstract
A resin molding apparatus includes: a first molding mold provided with a first member and a second member configured to move relative to the first member, and configured to form a cavity by the first member and the second member; a second molding mold configured to hold a substrate; and a mask member so as to be relatively immovable with respect to the first member, configured to make contact with a portion of the substrate when the first molding mold and the second molding mold are clamped, and formed with a flow portion through which a resin material existing in the cavity and pressurized by the second member is capable of flowing.