The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2023
Filed:
May. 28, 2019
Intel Corporation, Santa Clara, CA (US);
Feroz Mohammad, Chandler, AZ (US);
Srinivasa R. Aravamudhan, Beaverton, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments herein relate to systems, apparatuses, or processes for coupling or decoupling two substrates by heating pins on one of the substrates and either inserting or withdrawing the heated pins from solder elements on a BGA. In particular, by heating a plurality of pins on a first side of a first substrate, where the plurality of pins are substantially perpendicular to a plane of the substrate, inserting the heated plurality of pins into BGA attached to a second substrate where the BGA includes a plurality of solder elements aligned with the plurality of pins and where the heated plurality of pins melt the plurality of solder elements upon insertion. The inserted plurality of pins physically and/or electrically couple the first substrate and the second substrate.