The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2023
Filed:
Jun. 14, 2021
Applicant:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Inventors:
Yoichi Harayama, Nagano, JP;
Keiichi Takemoto, Nagano, JP;
Assignee:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01T 23/00 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01); H05B 3/03 (2006.01); H05B 3/22 (2006.01); H05B 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); H01L 21/67103 (2013.01); H05B 1/0233 (2013.01); H05B 3/03 (2013.01); H05B 3/22 (2013.01); H05B 2203/035 (2013.01);
Abstract
There is provided a substrate fixing device. The substrate fixing device includes: a base plate; and an electrostatic chuck that is fixed to the base plate and configured to adsorb a subject by electrostatic force. The electrostatic chuck includes: an adsorptive layer configured to adsorb and retain the subject; and a heater layer that is provided between the adsorptive layer and the base plate and configured to heat the subject retrained by the adsorptive layer. A thickness of the heater layer is uniform over an entire area of the heater layer.