The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2023
Filed:
Nov. 23, 2020
Applicant:
X-fab Semiconductor Foundries Gmbh, Erfurt, DE;
Inventor:
Ralf Lerner, Erfurt, DE;
Assignee:
X-FAB SEMICONDUCTOR FOUNDRIES GMBH, Erfurt, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); H01L 21/48 (2006.01); H01L 21/768 (2006.01); H01L 21/78 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); G03F 7/00 (2006.01); G06F 30/392 (2020.01);
U.S. Cl.
CPC ...
G03F 7/70433 (2013.01); G06F 30/392 (2020.01); H01L 21/30604 (2013.01); H01L 21/486 (2013.01); H01L 21/76816 (2013.01); H01L 21/7806 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 24/00 (2013.01);
Abstract
The invention relates to a geometric design and corresponding methods for components, which are produced on a carrier substrateand prepared by detachment in an etching processfor a subsequent absorption and a transfer with a stamp for application to a further substrate. The componentsare designed in such a way that additional active surfaces are provided for the etching processfor undercut the components, so that a faster, more reliable and more homogeneous etching profile is achieved.