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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11827789 B1

PDFFull Text
Date of Patent:
Nov. 28, 2023

Filed:

Jul. 19, 2017

Thermosetting resin composition, interlayer insulation resin film, composite film, printed wiring board, and production method thereof

Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Aya Kasahara, Tokyo, JP;

Tetsurou Iwakura, Tokyo, JP;

Assignee:

RESONAC CORPORATION, Tokyo, JP;

Attorney:

FITCH, EVEN, TABIN & FLANNERY, LLP

Primary Examiner:

Randy P Gulakowski

Assistant Examiner:

Ha S Nguyen

Int. Cl.
CPC ...
C08L 79/08 (2006.01); B32B 27/20 (2006.01); B32B 27/34 (2006.01); B32B 27/38 (2006.01); C08K 3/00 (2018.01); C08K 3/013 (2018.01); C08L 15/00 (2006.01); C08L 53/00 (2006.01); C08L 101/00 (2006.01); H01B 3/30 (2006.01); H05K 1/03 (2006.01); C08C 19/36 (2006.01); B32B 27/08 (2006.01); C08L 47/00 (2006.01); C08K 3/36 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
C08L 79/08 (2013.01); B32B 27/20 (2013.01); B32B 27/34 (2013.01); B32B 27/38 (2013.01); C08K 3/00 (2013.01); C08K 3/013 (2018.01); C08K 3/36 (2013.01); C08L 15/00 (2013.01); C08L 63/00 (2013.01); C08L 101/00 (2013.01); H01B 3/30 (2013.01); H05K 1/03 (2013.01); B32B 2307/204 (2013.01); B32B 2457/08 (2013.01); C08C 19/36 (2013.01); C08K 2201/005 (2013.01); C08L 2203/16 (2013.01);
Abstract

The present invention relates to a thermosetting resin composition containing an inorganic filler (A) containing a nanofiller (a), a thermosetting resin (B), and an elastomer (C); and a thermosetting resin composition containing an inorganic filler (A), a thermosetting resin (B), and an elastomer (C), wherein the inorganic filler (A) has at least two peaks of a first peak and a second peak in a particle size distribution measured according to the laser diffraction scattering method, and a peak position of the first peak appears at 0.3 to 0.7 μm, while a peak position of the second peak appears at 0.7 to 1.2 μm.

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