The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2023

Filed:

Jul. 01, 2021
Applicant:

Arizona Board of Regents on Behalf of Arizona State University, Scottsdale, AZ (US);

Inventors:

Zhi Zhao, Mesa, AZ (US);

Chao Wang, Chandler, AZ (US);

Yu Yao, Chandler, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 10/12 (2021.01); B29C 64/00 (2017.01); B33Y 10/00 (2015.01); H05K 1/09 (2006.01); B22F 1/054 (2022.01); B33Y 70/10 (2020.01);
U.S. Cl.
CPC ...
B29C 64/00 (2017.08); B22F 1/054 (2022.01); B22F 10/12 (2021.01); B33Y 10/00 (2014.12); B33Y 70/10 (2020.01); H05K 1/092 (2013.01); B22F 2301/255 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01);
Abstract

An additive manufacturing process for forming a metallic layer on the surface of the substrate includes fabricating a substrate from a polymerizable composition by a stereolithographic process, and contacting the reactive surface with an aqueous solution including a metal precursor. The metal precursor includes a metal, and the polymerizable composition includes a multiplicity of multifunctional components. Each multifunctional component includes a reactive moiety extending from a surface of the substrate to form a reactive surface. An interface between the reactive surface and the aqueous solution is selectively irradiated to form nanoparticles including the metal in a desired pattern. The nanoparticles are chemically coupled to the reactive surface by reactive moieties, thereby forming a metallic layer on the surface of the substrate.


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