The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2023
Filed:
Dec. 30, 2021
Avary Holding (Shenzhen) Co., Ltd., Shenzhen, CN;
Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd., Hebei, CN;
Garuda Technology Co., Ltd., New Taipei, TW;
Mao-Feng Hsu, Taoyuan, TW;
Zhi-Hong Yang, Guangzhou, CN;
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD., Hebei Province, CN;
GARUDA TECHNOLOGY CO., LTD., New Taipei, TW;
Abstract
The disclosure provides a circuit board assembly, which includes a core layer, an electronic component, a first shielding ring wall, a second shielding ring wall, a first circuit layer, a second circuit layer, a first insulating layer and a plurality of shielding columns. The core layer has an accommodating space, in which the accommodating space has an inner sidewall. The electronic component is disposed in the accommodating space. The first shielding ring wall is disposed in the accommodating space and covers the inner sidewall, in which the first shielding ring wall surrounds the electronic component and is not in contact with the electronic component. The second shielding ring wall is disposed in the core layer and surrounds the first shielding ring wall. The core layer is disposed between the first circuit layer and the second circuit layer. The shielding columns are disposed in the first insulating layer.