The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2023
Filed:
Feb. 01, 2022
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventors:
Tzu-Hsuan Yeh, Taoyuan, TW;
Chern-Yow Hsu, Chu-Bei, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/308 (2006.01);
U.S. Cl.
CPC ...
H01L 24/03 (2013.01); H01L 21/308 (2013.01); H01L 24/05 (2013.01); H01L 2224/03831 (2013.01);
Abstract
The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a bond pad disposed over a substrate and a passivation structure disposed over the substrate and the bond pad. The passivation structure has one or more sidewalls directly over the bond pad. A protective layer is disposed directly between the passivation structure and the bond pad. The passivation structure extends from directly over the protective layer to laterally past a sidewall of the protective layer that faces a central region of the bond pad.