The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2023

Filed:

Oct. 29, 2021
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Edward Augustyniak, Tualatin, OR (US);

David French, Lake Oswego, OR (US);

Sunil Kapoor, Vancouver, WA (US);

Yukinori Sakiyama, West Linn, OR (US);

George Thomas, Fremont, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01J 37/32 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67288 (2013.01); H01J 37/32183 (2013.01); H01J 37/32385 (2013.01); H01J 37/32577 (2013.01); H01J 37/32715 (2013.01); H01J 37/32935 (2013.01); H01L 21/67069 (2013.01); H01L 21/67167 (2013.01); H01L 21/67201 (2013.01); H01L 21/67207 (2013.01); H01L 21/67253 (2013.01); H01L 21/67259 (2013.01); H01L 21/68771 (2013.01); H01J 2237/3321 (2013.01);
Abstract

A system for controlling of wafer bow in plasma processing stations is described. The system includes a circuit that provides a low frequency RF signal and another circuit that provides a high frequency RF signal. The system includes an output circuit and the stations. The output circuit combines the low frequency RF signal and the high frequency RF signal to generate a plurality of combined RF signals for the stations. Amount of low frequency power delivered to one of the stations depends on wafer bow, such as non-flatness of a wafer. A bowed wafer decreases low frequency power delivered to the station in a multi-station chamber with a common RF source. A shunt inductor is coupled in parallel to each of the stations to increase an amount of current to the station with a bowed wafer. Hence, station power becomes less sensitive to wafer bow to minimize wafer bowing.


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