The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2023

Filed:

Aug. 30, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chuan-Hsiang Sun, Taoyuan, TW;

Bo-You Chen, Hsinchu, TW;

Chi-Chang Lai, Taichung, TW;

Hsiou-Yu He, Hsinchu, TW;

Peiwei Lin, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/02 (2006.01); G01R 1/04 (2006.01); G01R 1/067 (2006.01); G01R 1/073 (2006.01); G01R 1/44 (2006.01); G01R 31/00 (2006.01); G01R 31/20 (2006.01); G01R 31/26 (2020.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2889 (2013.01); G01R 1/06772 (2013.01);
Abstract

An apparatus for probing a device-under-test (DUT) includes a fixture disposed over the DUT, a circuitry film disposed along a contour of the fixture, a first signal connector, and a plurality of probing tips disposed on the circuitry film and extending toward the device-under-test. The circuitry film includes a first portion attached to a top sidewall of the fixture, and the first signal connector is disposed on and electrically connected to the first portion of the circuitry film. The first signal connector is electrically coupled to the probing tips through the circuitry film. A method for probing a DUT is also provided.


Find Patent Forward Citations

Loading…