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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11819975 B1

PDFFull Text
Date of Patent:
Nov. 21, 2023

Filed:

Dec. 11, 2018

Workpiece processing apparatus including a resin coater and a resin grinder

Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Shinya Watanabe, Tokyo, JP;

Ichiro Yamahata, Tokyo, JP;

Katsuhiko Suzuki, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:

Greer, Burns & Crain, Ltd.

Primary Examiner:

Karl Kurple

Int. Cl.
CPC ...
H01L 21/677 (2006.01); H01L 21/02 (2006.01); B24B 37/34 (2012.01); B24B 37/00 (2012.01); B24B 37/013 (2012.01); B24B 37/005 (2012.01); B24B 37/08 (2012.01); B24B 49/03 (2006.01); B24B 49/12 (2006.01); B24B 53/007 (2006.01); B24B 49/04 (2006.01); H01L 21/67 (2006.01); H01L 21/78 (2006.01); H01L 21/66 (2006.01); B05C 11/10 (2006.01); B05C 9/12 (2006.01); H01L 21/304 (2006.01); B24B 53/017 (2012.01);
U.S. Cl.
CPC ...
B24B 37/00 (2013.01); B24B 37/005 (2013.01); B24B 37/013 (2013.01); B24B 37/08 (2013.01); B24B 49/03 (2013.01); B24B 49/045 (2013.01); B24B 49/12 (2013.01); B24B 53/007 (2013.01); H01L 21/6773 (2013.01); H01L 21/67092 (2013.01); H01L 21/67253 (2013.01); H01L 21/78 (2013.01); H01L 22/12 (2013.01); B05C 9/12 (2013.01); B05C 11/1005 (2013.01); B24B 37/345 (2013.01); B24B 53/017 (2013.01); H01L 21/02013 (2013.01); H01L 21/304 (2013.01);
Abstract

A workpiece processing apparatus which coats a front surface of a workpiece with a resin, the workpiece having devices formed in regions demarcated by a plurality of planned dividing lines formed in a lattice pattern. The workpiece processing apparatus includes a cassette mounting base mounted with a cassette housing a plurality of workpieces, a resin coating unit that coats the front surface of the workpiece with the resin, a resin curing unit that cures the resin by applying an external stimulus to the coated resin, a resin grinding unit that flattens the cured resin by grinding the cured resin by a rotating grinding stone, and a conveying mechanism that conveys the workpiece between the units.

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