The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2023
Filed:
Jul. 30, 2020
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
You-Hua Chou, Hsinchu, TW;
Kuo-Sheng Chuang, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 9/28 (2006.01); B22F 1/0545 (2022.01); H01L 21/768 (2006.01); H01L 21/288 (2006.01); C23C 16/02 (2006.01); C23C 16/26 (2006.01);
U.S. Cl.
CPC ...
B22F 9/28 (2013.01); C23C 16/0281 (2013.01); C23C 16/26 (2013.01); H01L 21/288 (2013.01); H01L 21/76843 (2013.01); H01L 21/76871 (2013.01); H01L 21/76877 (2013.01); H01L 21/76882 (2013.01); H01L 21/76883 (2013.01); B22F 1/0545 (2022.01);
Abstract
A method of forming a conductive powder includes reducing, by a reduction reaction, a conductive powder precursor gas using a plasma to form the conductive powder. The method further includes filtering the conductive powder based on particle size. The method further includes dispersing a portion of the conductive powder having a particle size below a threshold value in a fluid.