The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2023
Filed:
Apr. 21, 2023
Applicant:
Yield Engineering Systems, Inc., Fremont, CA (US);
Inventors:
Kenneth Sautter, Fremont, CA (US);
Syndee Young, San Jose, CA (US);
Charudatta Galande, Fremont, CA (US);
Assignee:
YIELD ENGINEERING SYSTEMS, INC., Fremont, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/38 (2006.01); H05K 3/42 (2006.01); H05K 3/14 (2006.01);
U.S. Cl.
CPC ...
H05K 3/389 (2013.01); H05K 3/146 (2013.01); H05K 3/382 (2013.01); H05K 3/386 (2013.01); H05K 3/42 (2013.01); Y10T 29/49155 (2015.01);
Abstract
A method of improving the adhesion of a metal-organic interface in an electronic device includes providing a substrate with a metal structure, depositing a mono-layer of a selected silane composition on a surface of the metal structure with a vapor of the selected silane composition, and coating the treated surface with an organic material.