The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2023

Filed:

Jul. 13, 2020
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Jonghae Kim, San Diego, CA (US);

Milind Shah, San Diego, CA (US);

Periannan Chidambaram, San Diego, CA (US);

Assignee:

QUALCOMM INCORPORATED, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01L 23/498 (2006.01); H03F 3/213 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H03F 3/213 (2013.01); H05K 1/111 (2013.01); H05K 1/16 (2013.01); H05K 1/181 (2013.01); H05K 1/185 (2013.01); H05K 1/0231 (2013.01); H05K 1/0233 (2013.01);
Abstract

A package that includes a power amplifier and a substrate coupled to the power amplifier. The substrate includes an encapsulation layer, a capacitor device located in the encapsulation layer, an inductor located in the encapsulation layer, at least one first dielectric layer coupled to a first surface of the encapsulation layer, and a plurality of first interconnects coupled to the first surface of the encapsulation layer. The plurality of first interconnects is located at least in the at least one first dielectric layer. The plurality of first interconnects is coupled to the capacitor device and the inductor. The inductor and the capacitor device are configured to be electrically coupled together to operate as elements of a matching network for the power amplifier. The capacitor device is configured to be coupled to ground.


Find Patent Forward Citations

Loading…