The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2023
Filed:
Sep. 26, 2018
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Brian S. Jarrett, Hillsboro, OR (US);
Joseph Andrew Broderick, Beaverton, OR (US);
Juan Gabriel Cevallos Palomeque, Portland, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/427 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/427 (2013.01); H01L 21/4882 (2013.01);
Abstract
Semiconductor packages including a computing device with a heat source, and related devices and methods, are disclosed herein. For example, the computing device may have a heatsink physically and thermally coupled with the heat source. The heatsink may include a structural element internal to the heatsink. The structural element may cause a surface of the heatsink to deform to a non-planar configuration when the heatsink is coupled to the heat source.