The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2023
Filed:
Mar. 15, 2019
Yangtze Memory Technologies Co., Ltd., Wuhan, CN;
Gang Yang, Wuhan, CN;
Xiang Hui Zhao, Wuhan, CN;
Biao Zheng, Wuhan, CN;
Zui Xin Zeng, Wuhan, CN;
Lianjuan Ren, Wuhan, CN;
Jian Dai, Wuhan, CN;
YANGTZE MEMORY TECHNOLOGIES CO., LTD., Wuhan, CN;
Abstract
Embodiments of the present disclosure provide a method for forming a hole structure in a semiconductor device. The method includes forming a first etch mask over a stack structure, and removing a portion of the stack structure exposed by the first etch mask. The first etch mask may have a first mask opening with a first lateral dimension. The method may also include forming a second etch mask from the first etch mask. The second etch mask may have a second mask opening with a second lateral dimension that is greater than the first lateral dimension. The method may further include removing another portion of the stack structure exposed by the second etch mask to form the hole structure having a first hole portion and a second hole portion connected to and over the first hole portion.