The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2023

Filed:

May. 31, 2022
Applicant:

Changxin Memory Technologies, Inc., Hefei, CN;

Inventors:

Wei Li, Hefei, CN;

Taoyan Yan, Hefei, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); F27B 17/00 (2006.01); F27B 9/40 (2006.01); F27B 9/16 (2006.01); F27B 9/12 (2006.01); F27B 9/04 (2006.01); F27D 19/00 (2006.01); F27B 9/30 (2006.01);
U.S. Cl.
CPC ...
F27B 9/40 (2013.01); F27B 9/045 (2013.01); F27B 9/12 (2013.01); F27B 9/16 (2013.01); F27B 9/3005 (2013.01); F27B 17/0025 (2013.01); F27D 19/00 (2013.01); F27B 2009/124 (2013.01); F27D 2019/0018 (2013.01); F27D 2019/0059 (2013.01);
Abstract

A rapid thermal processing method and a rapid thermal processing device are provided. The rapid thermal processing method includes the following operations. A wafer is provided. A first heating operation is performed on the wafer to heat the wafer to a first temperature. The wafer is controlled to start rotating. The first temperature is maintained for a first predetermined time. A second heating operation is performed on the wafer to heat the wafer from the first temperature to a second temperature, and the second temperature is maintained for a second predetermined time. A third heating operation is performed on the wafer to heat the wafer from the second temperature to a third temperature, and the third temperature is maintained for a third predetermined time.


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