The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2023
Filed:
Mar. 16, 2020
Applicant:
Mitsubishi Materials Corporation, Tokyo, JP;
Inventors:
Assignee:
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/04 (2006.01); C21D 9/00 (2006.01); C22F 1/08 (2006.01);
U.S. Cl.
CPC ...
C22C 9/04 (2013.01); C21D 9/00 (2013.01); C22F 1/08 (2013.01);
Abstract
This free-cutting copper alloy contains Cu: more than 57.5% but less than 64.5%, Si: more than 0.20% but less than 1.20%, Pb: more than 0.001% but less than 0.20%, Bi: more than 0.10% but less than 1.00%, and P: more than 0.001% but less than 0.20%, with the balance being Zn and unavoidable impurities, wherein the total amount of Fe, Mn, Co and Cr is less than 0.45%, the total amount of Sn and Al is less than 0.45%, relationships of 56.3≤f1=[Cu]−4.8×[Si]+0.5×[Pb]+0.5×[Bi]−0.5×[P]≤59.5 and 0.12≤f2=[Pb]+[Bi]<1.0 are satisfied.