The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2023
Filed:
Sep. 21, 2020
Samsung Electronics Co., Ltd., Suwon-si, KR;
Hojoong Kim, Yongin-si, KR;
Taesung Kim, Seoul, KR;
Seokjun Hong, Siheung-si, KR;
Junyong Kim, Yongin-si, KR;
Donghyuk Jang, Seongnam-si, KR;
Youngjin Hong, Hwaseong-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Research & Business Foundation SUNGKYUNKWAN UNIVERSITY, Suwon-si, KR;
Abstract
A chemical mechanical polishing (CMP) apparatus and a CMP pad, the apparatus including a rotating plate; a CMP pad on an upper surface of the rotating plate; a rotating body facing the rotating plate and bringing a wafer into contact with the CMP pad to press the wafer; and a slurry supply configured to supply slurry to the CMP pad, wherein the CMP pad includes a pad body having a circular plate shape; a plurality of circular grooves on a bottom surface of the pad body, the plurality of circular grooves having a circular shape; and a connection groove connecting the plurality of circular grooves, the connection groove having a linear shape.