The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2023
Filed:
Dec. 06, 2022
Applicant:
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Inventor:
Gordon M. Grivna, Mesa, AZ (US);
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/165 (2006.01); H01L 21/285 (2006.01); H01L 29/06 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 29/165 (2013.01); H01L 21/28562 (2013.01); H01L 28/55 (2013.01); H01L 28/60 (2013.01); H01L 29/0688 (2013.01); H01L 28/40 (2013.01);
Abstract
A semiconductor device includes a work piece comprising a first material, a first side, a second side opposite to the first side, and a first coefficient of thermal expansion (first CTE). Recesses extend into the work piece from the first side and includes a pattern. A second material having a second CTE is within the recesses and is over the first material between the recesses; and A third material having a third CTE is over one of the second side or the second material. The third CTE and the second CTE are different than the first CTE.