The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2023
Filed:
Aug. 10, 2021
Shinko Electric Industries Co., Ltd., Nagano, JP;
Toshiyuki Okabe, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Abstract
A semiconductor device includes a lead frame having a first principal surface which includes a recess, and a second principal surface opposite to the first principal surface, a relay board, disposed in the recess, and having a third principal surface, and a fourth principal surface opposite to the third principal surface, wherein the fourth principal surface opposes a bottom surface of the recess, a first semiconductor chip disposed on the third principal surface, a first conductive material connecting the lead frame and the relay board, and a second conductive material connecting the relay board and the first semiconductor chip. A distance between the second principal surface and the third principal surface is less than or equal to a distance between the second principal surface and the first principal surface.