The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2023
Filed:
Sep. 22, 2021
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Shigeru Sugioka, Hiroshima, JP;
Keizo Kawakita, Hiroshima, JP;
Raj K. Bansal, Boise, ID (US);
Tsung Che Tsai, Tainan, TW;
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/784 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 21/784 (2013.01); H01L 23/544 (2013.01); H01L 2223/5446 (2013.01);
Abstract
Apparatuses including structures in scribe lines are described. An example apparatus includes: a first chip and a second chip; a scribe region between the first chip and the second chip; a crack guide region in the scribe region, the crack guide region including a dicing line along which the first chip and the second chip are to be divided; and a structure disposed in the crack guide region and extending along the dicing line.