The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2023

Filed:

Sep. 26, 2019
Applicant:

Showa Denko K.k., Tokyo, JP;

Inventors:

Susumu Nakazaki, Tokyo, JP;

Kuniaki Miyahara, Tokyo, JP;

Tomoyuki Fukuyo, Tokyo, JP;

Assignee:

Resonac Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C11D 7/50 (2006.01); C11D 7/32 (2006.01); C11D 11/00 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C11D 7/3209 (2013.01); C11D 7/5013 (2013.01); C11D 7/5022 (2013.01); C11D 11/0047 (2013.01); H01L 21/02057 (2013.01);
Abstract

Provided is a composition having high affinity for the surface of an adhesive, and excellent long-term storage stability. This composition comprises: a quaternary alkylammonium fluoride or a hydrate of a quaternary alkylammonium fluoride; and an aprotic solvent, wherein the aprotic solvent includes (A) an N-substituted amide compound having 4 or more carbon atoms and not containing active hydrogen on a nitrogen atom, and (B) an ether compound.


Find Patent Forward Citations

Nakazaki, Susumu. (2023). Composition, method for cleaning adhesive polymer, method for producing device wafer, and method for regenerating support wafer (U.S. Patent No. 11807837). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11807837

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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