The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2023
Filed:
Mar. 31, 2021
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); B81B 3/00 (2006.01); B81B 7/00 (2006.01); B81C 3/00 (2006.01); H01L 23/00 (2006.01); H01L 23/053 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00158 (2013.01); B81B 3/0021 (2013.01); B81B 7/0029 (2013.01); B81C 1/0023 (2013.01); B81C 1/00325 (2013.01); B81C 1/00357 (2013.01); B81C 1/00476 (2013.01); B81C 1/00539 (2013.01); B81C 1/00825 (2013.01); B81C 3/001 (2013.01); B81B 7/0006 (2013.01); B81B 7/0061 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0127 (2013.01); B81B 2207/012 (2013.01); B81B 2207/115 (2013.01); H01L 23/053 (2013.01); H01L 24/48 (2013.01); H01L 2224/48195 (2013.01);
Abstract
Various embodiments of the present disclosure are directed towards a method for forming a microelectromechanical systems (MEMS) device. The method includes forming a filter stack over a carrier substrate. The filter stack comprises a particle filter layer having a particle filter. A support structure layer is formed over the filter stack. The support structure layer is patterned to define a support structure in the support structure layer such that the support structure has one or more segments. The support structure is bonded to a MEMS structure.