The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2023
Filed:
Jun. 19, 2020
Applied Materials, Inc., Santa Clara, CA (US);
Puneet Narendra Jawali, San Jose, CA (US);
Nandan Baradanahalli Kenchappa, San Jose, CA (US);
Jason G. Fung, Santa Clara, CA (US);
Shiyan Akalanka Jayanath Wewala Gonnagahadeniyage, Santa Clara, CA (US);
Rajeev Bajaj, Fremont, CA (US);
Adam Wade Manzonie, Santa Clara, CA (US);
Andrew Scott Lawing, Newark, DE (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Embodiments herein generally relate to polishing pads and method of forming polishing pads. In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pad includes a polishing layer. At least a portion of the polishing layer comprises a continuous phase of polishing material featuring a plurality of first regions having a first pore-feature density and a plurality of second regions having a second pore-feature density that is different from the first pore-feature density. The plurality of first regions are distributed in a pattern in an X-Y plane of the polishing pad in a side-by-side arrangement with the plurality of second regions and individual portions or ones of the plurality of first regions are interposed between individual portions or ones of the plurality of second regions.