The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2023

Filed:

Mar. 27, 2022
Applicant:

United Microelectronics Corp., Hsinchu, TW;

Inventors:

Su Xing, Singapore, SG;

Chung Yi Chiu, Tainan, TW;

Hai Biao Yao, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/8232 (2006.01); H01L 21/225 (2006.01); H01L 21/762 (2006.01); H01L 29/749 (2006.01); H01L 29/786 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/78603 (2013.01); H01L 21/2253 (2013.01); H01L 21/762 (2013.01); H01L 21/8232 (2013.01); H01L 29/0653 (2013.01); H01L 29/66772 (2013.01); H01L 29/749 (2013.01);
Abstract

A method for fabricating a field-effect transistor includes the following steps. A gate structure layer in a line shape including a first region and a second region abutting to the first region is formed on a silicon layer. A first implanting process is performed to implant first-type dopants at least into a second portion of the second region of the gate structure layer. A second implanting region is performed to implant second-type dopants into the silicon layer to form a source region and a second region corresponding to the first region of the gate structure layer. The gate structure layer has a conductive-type junction at an interface between the first and second portions of the second region. A width of the silicon layer under the second region of the gate structure layer is smaller than a width of the gate structure layer.


Find Patent Forward Citations

Loading…