The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2023
Filed:
Jun. 27, 2018
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Brandon Marin, Chandler, AZ (US);
Whitney Bryks, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/492 (2006.01); H01L 23/532 (2006.01); H01L 23/498 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4922 (2013.01); H01L 23/4924 (2013.01); H01L 23/49822 (2013.01); H01L 23/49894 (2013.01); H01L 21/02112 (2013.01); H01L 23/5329 (2013.01);
Abstract
A package substrate may include a build-up layer. The build-up layer may include a dielectric material and one or more microspheres. The one or more microspheres may include a magnetic core that includes a first material that is a first oxidation-resistant material. Further, the one or more microspheres may include a shell to encapsulate the core, and the shell may include a second material that is a second oxidation-resistant material. The package substrate may further include a metal layer coupled with the build-up layer.