logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11804366 B1

PDFFull Text
Date of Patent:
Oct. 31, 2023

Filed:

Aug. 13, 2021

Plasma processing apparatus

Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Yuki Hosaka, Miyagi, JP;

Yoshihiro Umezawa, Miyagi, JP;

Toshiki Nakajima, Miyagi, JP;

Assignee:

TOKYO ELECTRON LIMITED, Tokyo, JP;

Attorney:

WEIHROUCH IP

Primary Examiner:

Ram N Kackar

Assistant Examiner:

Laureen Chan

Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/67 (2006.01); C23C 16/44 (2006.01); C23C 16/455 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32633 (2013.01); C23C 16/4412 (2013.01); C23C 16/45587 (2013.01); C23C 16/45589 (2013.01); C23C 16/45591 (2013.01); H01J 37/32449 (2013.01); H01J 37/32715 (2013.01); H01J 37/32834 (2013.01); H01L 21/02274 (2013.01); H01L 21/31116 (2013.01); H01L 21/6719 (2013.01); H01L 21/67069 (2013.01); H01J 2237/334 (2013.01);
Abstract

A plasma processing apparatus includes a baffle structure between a mounting table and a processing chamber. The baffle structure has a first member and a second member. The first member has a first cylindrical part extending between the mounting table and the processing chamber, and a plurality of through-holes elongated in the vertical direction is formed in an array in the circumferential direction in the first cylindrical part. The second member has a second cylindrical part having an inner diameter greater than the outer diameter of the cylindrical part for the first member. The second member moves up and down in a region that includes the space between the first member and the processing chamber.

Find Patent Forward Citations

Loading…