The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2023

Filed:

Feb. 15, 2019
Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventors:

Tomohiko Yamaguchi, Naka, JP;

Koutarou Masuyama, Naka, JP;

Kazuhiko Yamasaki, Naka, JP;

Akihiro Higami, Naka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/00 (2006.01); B22F 9/24 (2006.01); B23K 35/02 (2006.01); B23K 35/30 (2006.01); H01L 23/00 (2006.01); B22F 1/16 (2022.01); B22F 1/054 (2022.01); B22F 1/107 (2022.01); B22F 1/10 (2022.01); B22F 1/148 (2022.01); B22F 1/052 (2022.01);
U.S. Cl.
CPC ...
B22F 9/24 (2013.01); B22F 1/052 (2022.01); B22F 1/054 (2022.01); B22F 1/056 (2022.01); B22F 1/10 (2022.01); B22F 1/107 (2022.01); B22F 1/148 (2022.01); B22F 1/16 (2022.01); B23K 35/025 (2013.01); B23K 35/302 (2013.01); B23K 35/3006 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); B22F 2301/10 (2013.01); B22F 2301/255 (2013.01); B22F 2302/45 (2013.01); B22F 2304/056 (2013.01); B22F 2304/058 (2013.01); H01L 2224/29239 (2013.01); H01L 2224/29247 (2013.01); H01L 2224/8384 (2013.01);
Abstract

A metal particle aggregate includes metal particles and an organic substance. The metal particles include first particles that contain one or both of silver and copper in an amount of 70% by mass or more relative to 100% by mass of all metals and have a particle diameter of 100 nm or more and less than 500 nm at a ratio of 20 to 30% by number, and include second particles that have a particle diameter of 50 nm or more and less than 100 nm, and third particles that have a particle diameter of less than 50 nm at a ratio of 80 to 70% by number in total. Surfaces of the first to third particles are covered with the same protective film.


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