The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2023
Filed:
Feb. 22, 2018
Konica Minolta, Inc., Tokyo, JP;
Masayuki Ushiku, Yokohama, JP;
Hidenobu Ohya, Hachioji, JP;
Hideki Hoshino, Kokubunji, JP;
Masayoshi Yamauchi, Chofu, JP;
Takenori Omata, Kokubunji, JP;
Naoto Niizuma, Hachioji, JP;
Ryo Aoyama, Hino, JP;
Kazuho Urayama, Hino, JP;
KONICA MINOLTA, INC., Tokyo, JP;
Abstract
A pattern forming method capable of easily removing a discontinuous portion in a pattern while keeping resistance of the pattern low. A pattern forming method including at least a printing step of printing a pattern intermediate containing a conductive material on a base material, and a plating step of subjecting the pattern intermediate to an electroplating treatment, in which the pattern intermediate printed in the printing step has a plating target portion that is energized in the plating step and a discontinuous portion that is discontinuously formed from the plating target portion and is not energized in the plating step, and in the plating step, by performing an electric field plating treatment using a plating solution containing at least two or more types of metal salts containing different types of metals and a complexing agent, the discontinuous portion of the pattern intermediate is removed to form a pattern constituted by the plating target portion covered with a plating film.