The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2023

Filed:

Mar. 29, 2021
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Tsai-Hao Hung, Hsinchu, TW;

Shih-Chi Kuo, Yangmei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 5/00 (2006.01); G01K 7/32 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
G01K 7/32 (2013.01); B81B 3/0008 (2013.01); B81C 1/00944 (2013.01); B81B 2201/0278 (2013.01); B81B 2203/0136 (2013.01); B81B 2203/04 (2013.01); B81C 2201/013 (2013.01); B81C 2201/0105 (2013.01); B81C 2201/0116 (2013.01);
Abstract

The structure of a micro-electro-mechanical system (MEMS) thermal sensor and a method of fabricating the MEMS thermal sensor are disclosed. A method of fabricating a MEMS thermal sensor includes forming first and second sensing electrodes with first and second electrode fingers, respectively, on a substrate and forming a patterned layer with a rectangular cross-section between a pair of the first electrode fingers. The first and second electrode fingers are formed in an interdigitated configuration and suspended above the substrate. The method further includes modifying the patterned layer to have a curved cross-section between the pair of the first electrode fingers, forming a curved sensing element on the modified patterned layer to couple to the pair of the first electrodes, and removing the modified patterned layer.


Find Patent Forward Citations

Loading…