The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2023
Filed:
Mar. 15, 2018
Applicant:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Inventors:
Kazuya Kiguchi, Tokyo, JP;
Tomoo Nishiyama, Tokyo, JP;
Daisuke Fujimoto, Tokyo, JP;
Norihiko Sakamoto, Tokyo, JP;
Assignee:
RESONAC CORPORATION, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 15/092 (2006.01); C08K 3/013 (2018.01); C08K 3/34 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
C08K 3/013 (2018.01); B32B 15/092 (2013.01); C08K 3/34 (2013.01); H01L 23/36 (2013.01);
Abstract
An epoxy resin has a mesogenic structure and a siloxane structure. An epoxy resin composition includes the epoxy resin having the mesogenic structure and the siloxane structure, and a curing agent.
Kiguchi, Kazuya. (2023). Epoxy resin, epoxy resin composition, resin sheet, b-stage sheet, c-stage sheet, cured product, metal foil with resin, metal substrate, and power semiconductor device (U.S. Patent No. 11795293). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11795293
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile