The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2023
Filed:
Mar. 14, 2021
Applicant:
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Inventor:
Hung-Chang Yu, Hsinchu County, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10B 61/00 (2023.01); G11C 11/16 (2006.01); H01L 27/10 (2006.01); G11C 11/15 (2006.01); H10B 63/00 (2023.01);
U.S. Cl.
CPC ...
H10B 61/20 (2023.02); G11C 11/15 (2013.01); G11C 11/161 (2013.01); G11C 11/1655 (2013.01); G11C 11/1657 (2013.01); H01L 27/101 (2013.01); H10B 63/32 (2023.02);
Abstract
A method includes: providing a modulation circuit, determined an operation mode of a memory array, providing a first voltage corresponding to a positive temperature coefficient in response to a read operation of the memory array, and providing a second voltage corresponding to a negative temperature coefficient in response to a write operation of the memory array. The modulation circuit is configured to generate a temperature-dependent voltage and provide the same to the memory array.