The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2023

Filed:

Aug. 30, 2021
Applicant:

Imberatek Llc, Cedar Park, TX (US);

Inventors:

Risto Tuominen, Helsinki, FI;

Antti Iihola, Helsinki, FI;

Petteri Palm, Regensburg, DE;

Assignee:

IMBERATEK, LLC, Cedar Park, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/06 (2006.01); H01L 21/48 (2006.01); H01L 23/13 (2006.01); H01L 23/538 (2006.01); H01L 23/544 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); H05K 3/30 (2006.01); H05K 3/32 (2006.01); H01L 21/56 (2006.01); H05K 3/20 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 3/064 (2013.01); H01L 21/4846 (2013.01); H01L 21/56 (2013.01); H01L 23/13 (2013.01); H01L 23/5389 (2013.01); H01L 23/544 (2013.01); H01L 24/16 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 24/83 (2013.01); H05K 1/183 (2013.01); H05K 1/187 (2013.01); H05K 1/188 (2013.01); H05K 3/284 (2013.01); H05K 3/303 (2013.01); H05K 3/305 (2013.01); H05K 3/321 (2013.01); H01L 21/568 (2013.01); H01L 24/81 (2013.01); H01L 24/90 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54473 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/16 (2013.01); H01L 2224/18 (2013.01); H01L 2224/24227 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/81121 (2013.01); H01L 2224/81132 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81205 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/82039 (2013.01); H01L 2224/83132 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83205 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/9211 (2013.01); H01L 2224/92144 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01018 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/1517 (2013.01); H01L 2924/15153 (2013.01); H05K 3/205 (2013.01); H05K 3/32 (2013.01); H05K 3/4069 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/09563 (2013.01); H05K 2201/10674 (2013.01); H05K 2201/10977 (2013.01); H05K 2203/0353 (2013.01); H05K 2203/063 (2013.01); H05K 2203/0723 (2013.01); Y02P 70/50 (2015.11); Y10T 29/4913 (2015.01);
Abstract

The present publication discloses a circuit-board structure, including a conductor layer on an insulating material layer, and a conductor pattern on top of the conductor foil. A component is attached to the conductor foil and the conductor pattern, the component embedded at least in part in adhesive which attaches the component to the insulating material layer. A recess is formed in the conductor foil and the insulating material layer, and contact openings are in the insulating material layer at locations of contact areas of the component. Conductor material of the conductor foil is not present outside the conductor pattern, and the conductor foil is located between the conductor pattern and the insulating material layer.


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