The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2023
Filed:
Sep. 08, 2021
Ibiden Co., Ltd., Gifu, JP;
IBIDEN CO., LTD., Ogaki, JP;
Abstract
A component built-in wiring substrate includes a first insulating layer, a first conductor layer formed on a first surface of the first insulating layer and including a component mounting pad, a second conductor layer formed on a second surface of the first insulating layer on the opposite side with respect to the first surface, via conductors formed in the first insulating layer such that the via conductors are connecting the second conductor layer and the component mounting pad of the first conductor layer, a second insulating layer formed on the first insulating layer and having a component accommodating portion penetrating through the second insulating layer such that the component mounting pad is positioned at bottom of the accommodating portion, and an electronic component positioned in the accommodating portion of the second insulating layer such that the electronic component is mounted on the component mounting pad of the first conductor layer.