The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2023
Filed:
Dec. 11, 2020
Applicant:
At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;
Inventors:
Ivan Salkovic, Zagreb, HR;
Gerald Weidinger, Leoben, AT;
Johannes Stahr, St. Lorenzen im Mürztal, AT;
Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/05 (2006.01); H05K 3/06 (2006.01); H01F 27/06 (2006.01); G11B 5/21 (2006.01); G11B 5/127 (2006.01); G11B 5/147 (2006.01); G01D 5/14 (2006.01); H01Q 7/06 (2006.01); H05K 1/16 (2006.01); H05K 3/10 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/165 (2013.01); H01F 27/06 (2013.01); H05K 3/101 (2013.01); H05K 3/4652 (2013.01); H01F 2027/065 (2013.01); H05K 2201/086 (2013.01); H05K 2201/10265 (2013.01);
Abstract
A method of manufacturing a component carrier includes providing a stack with electrically conductive layer structures and at least one electrically insulating layer structure, embedding a magnetic inlay in the stack, and forming an electrically conductive coil structure at least partially based on the electrically conductive layer structures and surrounding at least part of the magnetic inlay.