The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2023
Filed:
Aug. 31, 2021
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Geun Won Lim, Yongin-si, KR;
Seok Cheon Baek, Hwaseong-si, KR;
Ji Sung Cheon, Ansan-si, KR;
Jong Woo Shin, Seoul, KR;
Bong Hyun Choi, Yongin-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H10B 43/27 (2023.01); H10B 43/40 (2023.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H10B 43/27 (2023.02); H10B 43/40 (2023.02);
Abstract
A semiconductor device includes a peripheral circuit region on a lower substrate, and including circuit elements, memory cell regions including memory cells on each of a first upper substrate and a second upper substrate, which are on the lower substrate, at least one cutting region between the first upper substrate and the second upper substrate, and at least one semiconductor pattern between the first upper substrate and the second upper substrate, and adjacent to the at least one cutting region.